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Advanced Analog Technology, Inc. - R&D Department Head

IC設計
【Company Name】
Advanced Analog Technology, Inc.
【Job Position】
R&D Department Head
【Job Specification】

In charge of the R&D Department and responsible for product design development.

Date:2019/08/22

Advanced Analog Technology, Inc. - Analog IC Design Manager

IC設計
【Company Name】
Advanced Analog Technology, Inc.
【Job Position】
Analog IC Design Manager
【Job Specification】

Responsible for product specification and design supervision

Date:2019/08/22

Global Unichip Corp. - DDR PHY Design Engineer

IC設計
【Company Name】
Global Unichip Corp.
【Job Position】
DDR PHY Design Engineer
【Job Specification】

IO circuit design and layout reviewing, DDR PHY design and verification

Date:2019/08/22

Global Unichip Corp. - Digital IP Design Engineer

IC設計
【Company Name】
Global Unichip Corp.
【Job Position】
Digital IP Design Engineer
【Job Specification】
  1. DDR/LPDDR/GDDR/HBM logic design and verification
  2. RTL design
  3. Digital Design Checks : CDC, LEC, STA, and etc.
Date:2019/08/22

Global Unichip Corp. - DFT Engineer (MBIST/Scan)

IC設計
【Company Name】
Global Unichip Corp.
【Job Position】
DFT Engineer (MBIST / Scan)
【Job Specification】
  1. Involve in ensure total silicon quality both in design phase
  2. Low power DFT design implementation / verification
Date:2019/08/22

Macronix International Co.,Ltd. - 3D NAND Advanced Module Process Development Manager

IC製造
【Company Name】
Macronix International Co.,Ltd.
【Job Position】
3D NAND Advanced Module Process Development Manager
【Job Specification】
  1. Lithography: Experience with lithography simulation software and application to state of art high resolution imaging
  2. Etch: Strong understanding in principles of plasma dry etch processing, and wet processing and/or chemistry experience in 3D Memory
  3. Thin Film: Experience in a variety of thin film deposition techniques, particularly LPCVD/PECVD/ALD/PEALD, PVD, Tungsten and Copper
  4. Diffusion: Experience in a variety of Diffusion deposition/oxidation techniques, particularly Diffusion Furnace/Plasma treatment/IPD (ONO) engineering/Polysilicon engineering/Nitride charge trapping/ALD and wet etch/clean
  5. CMP: To design, optimize and characterize dielectric and conductive CMP process needed for successful integration processes in 3D Memory
Date:2019/08/22

Nuvoton Technology Corp. - Senior Marketing Director

IC設計
【Company Name】
Nuvoton Technology Corp.
【Job Position】
Senior Marketing Director
【Job Specification】

Build the MCU Product and Marketing Strategy

Date:2019/08/22

Nuvoton Technology Corp.Senior MCU/MPU Architect

IC設計
【Company Name】
Nuvoton Technology Corp.
【Job Position】
Senior MCU/MPU Architect
【Job Specification】

MCU/MPU architecture define

Date:2019/08/22

Realtek Semiconductor Corp. - Senior Algorithm Development Engineer

IC設計
【Company Name】
Realtek Semiconductor Corp.
【Job Position】
Senior Algorithm Development Engineer
【Job Specification】
  1. Wired or wireless communication system transceiver architecture or algorithm design.
  2. RF/Analog frontend & baseband system spec definition
  3. Channel and impairment modeling
  4. Baseband algorithm development
  5. System performance verification
Date:2019/08/22

Realtek Semiconductor Corp. - Senior Physical Design/APR Engineer

IC設計
【Company Name】
Realtek Semiconductor Corp.
【Job Position】
Senior Physical Design / APR Engineer
【Job Specification】
  1. Work with Digital Design team for Physical Design of SoC chips including top level floor planning, block partition, timing budgeting, power planning, block integration, whole chip timing closure, and tape out
  2. Responsible for physical design methodology research and development
  3. Cross site projects coordination and management
Date:2019/08/22
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