產業新訊
Winbond Electronics Corp. - NAND Flash Process Module Engineer
IC製造
【Company Name】
Winbond Electronics Corp.
Winbond Electronics Corp.
【Job Position】
NAND Flash Process Module Engineer
NAND Flash Process Module Engineer
【Job Specification】
- NAND Flash technology development
1. Hot Process (Furnace & RTP), LPCVD, ALD, Wet for advance NOR, 2xnm beyond NAND flash development.
2. NAND Flash W gate & Air-Gap development.
3. The research experience of CoSi/NiSi material.
4. CVD gap fill and step coverage process control.
5. RRAM TMO new material development.
【Job Requirements】
- With strong hands-on experience in silicon fabrication processes: etching or diffusion
- With NAND Flash 20nm or 1Xnm process development experience, and at least 10-year of module process development experiences
【Job Location】
Taichung, Taiwan
Taichung, Taiwan
Date：2019/08/22