產業新訊
Winbond Electronics Corp. - NAND Flash Process Integration Engineer
IC製造
【Company Name】
Winbond Electronics Corp.
Winbond Electronics Corp.
【Job Position】
NAND Flash Process Integration Engineer
NAND Flash Process Integration Engineer
【Job Specification】
NAND Flash technology development
【Job Requirements】
- With strong hands-on experience in silicon fabrication processes and integration: lithography, etching, diffusion, thin films deposition.
- Expected onboarding date: as soon as possible
- With NAND Flash 20nm or 1Xnm process development experience, and at least 10-year of process technology development experiences (or yield enhancement experience)
【Job Location】
Taichung, Taiwan
Taichung, Taiwan
Date：2019/08/22