IC製造
【Company Name】
Winbond Electronics Corp.
【Job Position】
NAND Flash Product (Test) Engineer
【Job Specification】
With NAND Flash product engineering experience (at least 1 generation PE experience for process development), and 10+ year of product engineering career with strong hands-on bench testing
【Job Requirements】
- Prefer to be willing to work in Taiwan; this is negotiable for outstanding candidates.
- Expected onboarding date: 2019/Q4
- 10+ year of product engineering career with strong hands-on bench testing
【Job Location】
Hsinchu, Taiwan