IC製造
【Company Name】
Macronix International Co.,Ltd.
【Job Position】
3D NAND Advanced Module Process Development Manager
【Job Specification】
- Lithography: Experience with lithography simulation software and application to state of art high resolution imaging
- Etch: Strong understanding in principles of plasma dry etch processing, and wet processing and/or chemistry experience in 3D Memory
- Thin Film: Experience in a variety of thin film deposition techniques, particularly LPCVD/PECVD/ALD/PEALD, PVD, Tungsten and Copper
- Diffusion: Experience in a variety of Diffusion deposition/oxidation techniques, particularly Diffusion Furnace/Plasma treatment/IPD (ONO) engineering/Polysilicon engineering/Nitride charge trapping/ALD and wet etch/clean
- CMP: To design, optimize and characterize dielectric and conductive CMP process needed for successful integration processes in 3D Memory
【Job Requirements】
- Fundamentals and roles in all processing steps of forming 3D memory devices, peripheral devices and their IC circuit
- Strong understanding of surface and analytical characterization techniques such as SEM, TEM, CDSEM, XPS, AFM, XRD, AES, EBSD, SIMS etc.
- Deep understanding of various dielectric /electrical evaluation methods and techniques such as leakage, breakdown, resistance, & on current
- Experience and/or in-depth knowledge of process ownership and development
- Interact and collaborate with integration engineers to develop robust unit process and related module as well as transfer the process to production fab
- Excellent verbal and written communication skill
- M.S. or PhD in Chemical Engineering, Materials Science, Chemistry or related discipline is required
- Must have technical expertise within semiconductor processing engineering preferably in 3D Memory process development for leading edge technology
- 10 years of experience in semiconductor process development is desired
【Job Location】
Hsinchu, Taiwan